JOYSMT
JOY TECHNOLOGY CO.,LIMITED
SMT Equipment | Electronic Component Provider
judy@joysmt.com
+86-13823724660
judy@joysmt.com
+86-13823724660
+86 13823724660
+86 0755-36527060
judy@joysmt.com
evan@joysmt.com
Skype:+86 13823724660
WhatsApp:+86
13823724660
Location : Home > Service > Technique & Support
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most well- suited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
There are many factors that affect the solder joint reliability in the commercial electronic packaging. Voids, especially, mi- cro-voids recently get more attention from industry because the line and space becomes finer and voids may have more po- tential to affect the solder joint reliability. Voiding in solder joint reliability heavily depends on the soleder materials and the surface finish.
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection.
The AOI detector can be used in multiple locations on the production line, and it can detect special defects at various locations.However, the AOI detector should be placed in a position where the most defects can be identified and corrected as early as possible. JOYSMT describes in detail the role of the AOI detector in three inspection positions.
Hot Air and IR are the two main types of rework stations used by OEMs and PCB contract manufacturers today. Both have advantages and disadvantages and choosing the right one for your application requires a careful consideration of a number of factors, including your budget, your working requirements and the capabilities of your staff.
The software optimization result of Panasonic CM602 is a combination of factors, but the result is often due to the setting of certain conditions, and the result is quite different from the ideal result. At this time, the artificial condition setting will improve the optimization result. Need to consider the following aspects
Mounting accuracy ±40 μm/chip, ±35 μm/QFP ≧ □24 mm, ±50 μm/QFP <□24 mm (Cpk ≧1)
Component Size 0402 Chip *5～ L 32 mm × W 32 mm × T 8.5 mm *8
General Purpose of 0402 chips when the optional Ver.5 * 5 ~ L 100 mm × W 50 mm × T 15 mm * 6
The electronic components are taken out from the packaging tape by the high-speed moving patch head. During the process of mounting on the printed board, there are several faults such as unacceptable, lost after suction, etc. These faults will cause a large number of faults. Component loss, according to our experience, component suction is usually caused by the following reasons
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